MediaTek Dimensity 6100+ 6nm 5G SoC announced

On the cutting edge of mobile technology, MediaTek has recently unveiled its Dimensity 6100+ System-on-Chip (SoC) as part of the Dimensity 6000 series, following the successful launch of Dimensity 6020 and 6080 SoCs. This new chipset introduces an advanced 5G modem that supports the 3GPP Release 16 standard, boasting up to 140MHz 2CC 5G Carrier Aggregation. MediaTek also incorporates its UltraSave 3.0+ technology for enhanced power-saving capabilities. With this release, the company aims to democratize higher-end features and bring impressive upgrades to mainstream 5G devices.

Powerful Performance

The MediaTek Dimensity 6100+ SoC boasts an impressive architecture to deliver powerful performance and exceptional user experiences. The chipset is built on TSMC’s 6nm process, allowing for efficient power utilization and increased overall efficiency compared to the previous generation.

The CPU configuration includes two Arm Cortex-A76 big cores clocked at 2.2GHz and six Arm Cortex-A55 efficiency cores clocked at 2GHz. This combination ensures a seamless balance between high-performance tasks and power-efficient operations, leading to improved multitasking and smooth user interactions.

Enhanced Multimedia and AI Support

The Dimensity 6100+ is designed to enhance multimedia capabilities in mobile devices. It supports AI-powered cameras, enabling advanced features like hardware multi-frame noise reduction (MFNR), three-dimensional noise reduction (3DNR), and AI-powered face detection (AI-FD). These features result in stunning photography and improved low-light performance, giving smartphone users the ability to capture professional-grade images effortlessly.

Additionally, the chipset supports 10-bit displays, delivering an expanded color gamut and a more immersive visual experience for users. With MediaTek’s commitment to providing outstanding GPU performance, users can enjoy seamless gaming and high-definition video playback on their devices.

Wide Range of Connectivity Options

The Dimensity 6100+ SoC is equipped with a comprehensive suite of connectivity options, catering to both developing and developed markets. It supports 2G, 3G, 4G, and 5G multi-mode, enabling seamless connectivity regardless of the network infrastructure. The integration of 4G and 5G Carrier Aggregation (CA) further enhances data speeds and network stability, ensuring a seamless user experience.

Moreover, the chipset features integrated dual-band Wi-Fi 5 (a/b/g/n/ac) and Bluetooth 5.2 for fast and reliable wireless connections. The inclusion of multiple global navigation satellite systems (GNSS) such as GPS, BeiDou, Glonass, Galileo, and QZSS, ensures accurate and precise location tracking.

Availability

According to MediaTek, the first smartphones powered by the Dimensity 6100+ SoC will hit the market in the third quarter of 2023. This chipset’s introduction comes at a critical time when the demand for mainstream mobile devices with next-generation connectivity is rapidly growing.

Verdict -

With the announcement of the MediaTek Dimensity 6100+ 6nm 5G SoC, the company continues to push the boundaries of mobile technology. By democratizing high-end features and bringing advanced 5G capabilities to mainstream devices, MediaTek empowers smartphone manufacturers to stay ahead of the curve and offer consumers cutting-edge performance, efficiency, and connectivity. The arrival of the Dimensity 6100+ is undoubtedly set to revolutionize the smartphone landscape in 2023 and beyond.